发明名称 |
SEMICONDUCTOR PACKAGE HAVING SOCKET FUNCTION, SEMICONDUCTOR MODULE, ELECTRONIC CIRCUIT MODULE, AND CIRCUIT BOARD WITH SOCKET |
摘要 |
Disclosed is a semiconductor package 3 including a socket 1 which is formed on the top surface 3a for enabling electrical conductivity and a connecting terminal 2 which is formed on the bottom surface 3b for enabling electrical conductivity. The socket 1a has a depressed shape, and a spiral contact 1 is formed in the depression 1c. An electronic circuit module is constructed by mounting and electrically connecting a semiconductor module wherein a plurality of semiconductor packages 3 is stacked on a circuit board. A circuit board with sockets is constructed by mounting a socket board on a circuit board. |
申请公布号 |
EP1879228(A1) |
申请公布日期 |
2008.01.16 |
申请号 |
EP20060732101 |
申请日期 |
2006.04.19 |
申请人 |
ADVANCED SYSTEMS JAPAN INC. |
发明人 |
HIRAI, YUKIHIRO |
分类号 |
H01L25/10;H01L23/12;H01L23/28;H01L23/32;H01L25/11;H01L25/18;H01R13/24;H01R33/76;H05K1/02;H05K1/14;H05K1/18 |
主分类号 |
H01L25/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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