发明名称 |
MULTI-CHIP MODULE AND METHOD OF MANUFACTURE |
摘要 |
A multi-chip module and a method for manufacturing the multi-chip module. A first semiconductor chip is mounted to a support substrate and a second semiconductor chip is mounted to the first semiconductor chip. The second semiconductor chip has a smaller dimension than the first semiconductor chip. A spacer is coupled to the second semiconductor chip. Bonding pads on the first and second semiconductor chips are wirebonded to bonding pads on the support substrate. A third semiconductor chip is mounted to the spacer and bonding pads on the third semiconductor chip are wirebonded to bonding pads on the support substrate. |
申请公布号 |
EP1878048(A2) |
申请公布日期 |
2008.01.16 |
申请号 |
EP20060739368 |
申请日期 |
2006.03.24 |
申请人 |
SPANSION LLC |
发明人 |
YAN, JOHN;DU, YONG;SYMMON, BRUCE E. |
分类号 |
H01L21/98;H01L25/065 |
主分类号 |
H01L21/98 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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