发明名称 DATENTRÄGER MIT EINEM AUF LEITERRAHMEN BASIERTEN MODUL MIT DOPPELSEITIGER CHIP-ABDECKUNG
摘要 A data carrier has a chip with chip contacts, a transmission coil for contactless communication with a write/read station, a metal lead frame with a chip carrying part and contact forming parts, and a chip cover made of electrically insulating material. The transmission coil has coil contacts. The chip cover has a first cover part covering the chip at one side of the metal lead frame and a second cover part covering the other side of the metal lead frame. The second cover part has electrically conducting passages electrically connecting the coil contacts to the contact forming parts that are otherwise connected to the chip contacts. The chip carrying part and the first and second contact forming parts are electrically insulated with respect to each other and are arranged in a substantially coplanar relationship to each other.
申请公布号 AT383620(T) 申请公布日期 2008.01.15
申请号 AT19990901835T 申请日期 1999.02.11
申请人 NXP B.V. 发明人 RIENER, THOMAS;POSCH, STEFAN
分类号 B42D15/10;G06K19/077 主分类号 B42D15/10
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