Electronic component with a housing package

摘要

The invention relates to an electronic component with a housing package comprising a number of layers of plastic with at least one buried interconnect layer and with at least one semiconductor chip, which has pointed-conical external contacts distributed on an outer side. The pointed-conical external contacts penetrate through one of the layers of plastic and form contact vias with respect to the buried interconnect layer. Furthermore, the invention relates to a method for producing such an electronic component.