| 摘要 |
<p>A transducer assembly is provided to increase the size of a wire bonding and a bonding property on a substrate by ball-bonding both sides of a semiconductor die with the substrate. A vibrator(110) generates an ultrasonic wave. A transducer body(120) is coupled with the vibrator and outputs the ultrasonic wave. A horn(130) is coupled with the transducer body, and focuses the ultrasonic wave at a front portion thereof. A capillary(140) is coupled with the front portion of the horn. A wire penetrates the capillary. A conductive layer(150) is formed on a surface, which is apart from upper and lower ends of the capillary. A first discharge tip(163) provides an arc at a wire under the capillary to form a first ball. A second discharge tip(164) is arranged to be opposed to the first discharge tip with the conductive layer between them. The second discharge tip forms a second ball on the wire under the capillary. A high voltage source(161) is connected to the first and second discharge tips and applies a high voltage to the first and second discharge tips.</p> |
