Semiconductor image sensor module, method for manufacturing the same as well as camera and method for manufacturing the same

摘要

A semiconductor image sensor module and a method for manufacturing thereof as well as a camera and a method for manufacturing thereof are provided in which a semiconductor image sensor chip and an image signal processing chip are connected with a minimum parasitic resistance and parasitic capacity and efficient heat dissipation of the image signal processing chip and shielding of light are simultaneously obtained. A semiconductor image sensor module 1 at least includes a semiconductor image sensor chip 2 having a transistor forming region on a first main surface of a semiconductor substrate and having a photoelectric conversion region with a light incident surface formed on a second main surface on the side opposite to the first main surface and an image signal processing chip 3 for processing image signals formed in the semiconductor image sensor chip 2 , wherein a plurality of bump electrodes 15 a are formed on a first main surface, a plurality of bump electrodes 15 b are formed on the image signal processing chip 3 , both the chips 2 and 3 are formed to be laminated through heat dissipating means 4 and the plurality of bump electrodes 15 a of the semiconductor image sensor chip 2 and the plurality of bump electrodes 15 b on the image signal processing chip 3 are electrically connected.