发明名称 MANUFACTURING METHOD OF WIRING BOARD, MANUFACTURING METHOD OF ELECTRON SOURCE, MANUFACTURING METHOD OF IMAGE DISPLAY APPARATUS AND IMAGE REPRODUCING APPARATUS
摘要 <p>A manufacturing method of a wiring board, a manufacturing method of an electron source, a manufacturing method of an image display apparatus, and an image reproducing apparatus are provided to improve connection reliability of a wire formed in a groove and an electrode installed on a substrate surface near to the groove. A substrate(A) has an adjacent region near to a groove. A first wire(B) has a first portion(4) and a second portion(5) extended from the first portion. The first portion is formed on a first region(711) in the groove. The second portion is formed on a second region(712) that is a part of the adjacent region. The substrate having the groove is prepared. A contact angle of the second region is differentiated from that of a third region that is another part of the adjacent region. The third region encloses the second region with the groove. A conductive paste is applied to the groove and to a part of the adjacent region.</p>
申请公布号 KR20080005850(A) 申请公布日期 2008.01.15
申请号 KR20070064152 申请日期 2007.06.28
申请人 CANON KABUSHIKI KAISHA 发明人 MORIYA MASAFUMI;ISHIWATA KAZUYA;SUZUKI YOSHIO
分类号 H01J1/30;H01J1/316;H01J9/02;H01J31/12 主分类号 H01J1/30
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