METHOD OF TREATING THE SURFACE OF COPPER AND COPPER

摘要

A copper surface treatment method is provided to ensure adhesive strength between a copper surface and an insulating layer without forming a recess and a protrusion over 1mum due to copper surface treatment and to improve insulation reliability between wirings. A copper is also provided. The surface treatment method is provided with a step of discretely forming a metal nobler than copper on the copper surface, and a step of successively oxidizing the copper surface by an alkaline solution including an oxidizing agent. The copper whose surface is treated by such method is also provided.