IMAGE SENSOR PACKAGE AND METHOD OF FABRICATING THE SAME

摘要

An image sensor package and its manufacturing method are provided to improve the sensitivity of the image sensor by preventing an inlet beam emitted from a side surface of the image sensor. Plural line patterns(112) are arranged on a transparent substrate(110) in a predetermined shape. Pillar bumps(114a) are formed on plural line patterns to be opposed to the transparent substrate, and electrically couple the line patterns with an external circuit. An image sensor chip(118a) is laminated on the line patterns to be electrically connected to the line pattern. A resin protection dam(116) is formed between the transparent substrate, on an inner surface of the line pattern, and the image sensor chip. The resin protection dam includes an aperture for exposing a sensing region of the image sensor chip. A resin(120a) is applied on the transparent substrate outside the resin protection dam. A cavity is formed between the sensing region and the transparent substrate.