SEMICONDUCTOR MEMORY DEVICE HAVING BUMP PADS AND TEST METHOD THEREOF

摘要

A semiconductor memory device having a bump pad is provided to enable a test even if a packing process for a bump is performed, by including a test pad for testing an inner circuit in a test mode. A semiconductor memory device includes first pads, second pads and an inner circuit(110) connected to the first pads. The inner circuit is tested by the second pads in a test mode. The first pads can be bump pads(122). A pad connection circuit(130) can determine whether to connect the second pads to the inner circuit according to the operation state of the semiconductor memory device. The pad connection circuit can connect the second pads to the inner circuit in response to a mode signal wherein the mode signal is transferred from the outside in a test mode.