| 摘要 |
<P>PROBLEM TO BE SOLVED: To rovide plasma processing equipment which can perform various plasma processing even in a process where the conditions of plasma processing are limited by its device configuration when at least two plasma processing steps are performed in the same plasma reaction chamber. <P>SOLUTION: When at least two plasma processing steps are performed in the same plasma reaction chamber, CW AC power or pulse modulated AC power is selected properly as plasma processing power at each step. Consequently, various plasma processing can be performed even in a process where the conditions of plasma processing are limited by its device configuration. <P>COPYRIGHT: (C)2008,JPO&INPIT |
