| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board, a connection board, a semiconductor device, a method of manufacturing the same, a circuit board, and an electronic apparatus, which are capable of performing processes without expensive equipment and of eliminating damages on packages. SOLUTION: The wiring board includes a substrate (10) formed with an opening (14), a wiring pattern (20) having a bent part (22) which is formed on one side surface of the substrate (10) and is protruded from the other side surface of the substrate (10) by entering the opening (14), and resin 26 which is filled in the bent part (22) to prevent a large deformation thereof and to allow a certain level of deformation. The bent part (22) becomes an external terminal of the semiconductor device. COPYRIGHT: (C)2008,JPO&INPIT
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