发明名称 MANUFACTURING METHOD OF PLATING FILM AND PLATING TREATMENT DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of a plating film, which reduces an influence of oxygen supply on the flow of a plating solution and yields a highly reliable plating film, and a plating treatment device. SOLUTION: At least a pair of electrodes 20a and 20b is placed in the plating solution 5, and a substrate P is immersed in the plating solution 5. By applying a voltage to the pair of electrodes 20a and 20b, oxygen is generated in the plating solution 5 through electrolysis of water contained in the plating solution 5, and the plating film is formed on the substrate P. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008001966(A) 申请公布日期 2008.01.10
申请号 JP20060175135 申请日期 2006.06.26
申请人 SEIKO EPSON CORP 发明人 HASHI YUKIHIRO
分类号 C23C18/31;C23C18/44;H05K3/18 主分类号 C23C18/31
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