| 摘要 |
PROBLEM TO BE SOLVED: To make a semiconductor device compact easily which is equipped with a semiconductor chip having a diaphragm vibrating in response to pressure variations. SOLUTION: The semiconductor device 1 comprises: the semiconductor chip 5; a circuit chip 3 connected electrically thereto; and a shield case 7 for containing them; wherein the semiconductor chip 5 is arranged so as to be stacked on the surface 3a of the circuit chip 3 in such the state that the diaphragm 29 faces the circuit chip 3; the shield case 7 is constituted such that an insulating film is formed on a conductive member, and equipped with an approximately plate-like stage section 41 for fixing the circuit chip 3, a top panel section 43 which is arranged so as to face the upper surface 5a of the semiconductor chip 5, and a side wall section 45 which extends from the peripheral edge of the stage section 41 to the peripheral edge of the top panel section 43 so as to surround the semiconductor chip 5 and the circuit chip 3; and furthermore, an external connection terminal 9 is formed on the rear face 3b of the circuit chip 3, and an exposing through-hole 41c for exposing the external connection terminal 9 to the outside is formed in the stage section 41. The manufacturing method of the device 1 is also provided. COPYRIGHT: (C)2008,JPO&INPIT |
