| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal deposition layer laminated film which has a metal deposition layer on a resin film substrate, causes neither the detachment of the metal conductive layer during formation of a circuit pattern in manufacturing a printed circuit board by forming an electric circuit of a practical thickness through electroplating, with the metal deposition layer as electrode, and transferring the electric circuit to e.g. a prepreg through e.g. pressure thermal transfer nor the detachment of the metal conductive layer in the process of forming a circuit pattern, enables the design of microscopic circuits, allows easy removal of the resin film substrate from e.g. the prepreg after the transfer, produces a transferred circuit pattern layer having a smooth surface after the removal and allows uniform and instantaneous removal of the electrode layer alone without paste residue or contamination on the copper surface. SOLUTION: A re-peelable adhesive layer of a thickness of 0.05-10μm is formed on one smooth side of a resin film substrate, a metal deposition layer is formed on the re-peelable adhesive layer, and an rustproof layer is formed on the metal deposition layer to prevent corrosion during handling. COPYRIGHT: (C)2008,JPO&INPIT
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