发明名称 RFID TAG PACKAGING SYSTEM
摘要 <p>An electronic packaging system includes an electronic device and an array of surface elements surrounding the electronic device. A plurality of the surface elements of the array have a first height. The electronic device has a second height. The first height is greater than the second height so the array of surface elements protects the electronic device from loading.</p>
申请公布号 WO2008005547(A2) 申请公布日期 2008.01.10
申请号 WO2007US15599 申请日期 2007.07.05
申请人 MICROSTRAIN, INC. 发明人 ARMS, STEVEN, W.;HAMEL, MICHAEL, J.
分类号 H01R12/00 主分类号 H01R12/00
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