| 摘要 |
<p>It is intended to provide a conductive adhesive which does not have a problem of migration of a conductive metal upon applying voltage and exhibits a low resistance value. One embodiment of the invention relates to a conductive adhesive containing a conductive filler and a resin, characterized in that the conductive filler contains an alloy powder of silver and tin and further contains an additive including at least one member of a chelator, an antioxidant and a metal surfactant. As the additive, for example, as the chelator, a hydroxyquinoline, a salicylidene aminothiophenol or a phenanthroline, as the antioxidant, a hydroquinone or a benzotriazole, as the metal surfactant, an organic acid, an acid anhydride or an organic acid salt or the like can be used.</p> |
