发明名称 LIGHT-EMITTING DIODE PACKAGE
摘要 <P>PROBLEM TO BE SOLVED: To provide an LED package capable of highly efficient heat radiation and ensuring stable color conversion and transmitted light quantity. <P>SOLUTION: A refrigerant R is sealed in the inside of a case member 30 covering an LED chip 20. A phosphor P is diffused in the refrigerant R. According to this configuration, heat exchange occurs between the heat-generating LED chip 20 and the refrigerant R therearound, and heat convection occurs in the refrigerant R. The heat is transmitted by the heat convection to the case member 30, and is radiated in the ambient air via the case member 30. In this way, highly efficient heat radiation can be possible. Further, since the heat convection causes uniformity of diffusion in the refrigerant R of the phosphor P, the stable color conversion and transmitted light quantity can be ensured. Still further, since no special countermeasure is required for uniform diffusion of the phosphor P in manufacturing steps, the manufacturing steps can be simplified. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008004689(A) 申请公布日期 2008.01.10
申请号 JP20060171478 申请日期 2006.06.21
申请人 NODA SCREEN:KK 发明人 OGAWA HIROYOSHI
分类号 H01L33/32;H01L33/50;H01L33/54;H01L33/56;H01L33/62;H01L33/64 主分类号 H01L33/32
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