发明名称 METHOD FOR PREDICTING CURING RATE OF THERMOSETTING RESIN
摘要 PROBLEM TO BE SOLVED: To provide a method for predicting the curing rate of a thermosetting resin, in which such a model as more coinciding with real curing characteristics is used in a state combing a suitable temperature with a suitable time, thereby enabling to easily grasp the characteristics of the thermosetting resin, such as the easy acquisition of thermosetting resin-processing conditions. SOLUTION: The method for predicting the curing rate of the thermosetting resin is characterized by predicting the curing rate P of the thermosetting resin according to the following expressions (1), (2), and (3): P=1-expä-(K×t)<SP>1/N</SP>} (1), K=α<SB>0</SB>expä-Q<SB>K</SB>/(kT)} (2), N=β<SB>0</SB>expä-Q<SB>N</SB>/(kT)} (3), using a curing rate constant K (K>0) and a time t, wherein Q<SB>K</SB>represents an activation energy for curing the thermosetting resin; Q<SB>N</SB>corresponds to the activation energy in the expression (3); T is the absolute temperature of added heat; (k) is Boltzmann's constant;α<SB>0</SB>is a frequency factor showing the collision probability of the molecule of the thermosetting resin with its other molecule;β<SB>0</SB>corresponds to the frequency factor of the expression (3). COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008001878(A) 申请公布日期 2008.01.10
申请号 JP20060254135 申请日期 2006.09.20
申请人 NIPPON AVIONICS CO LTD 发明人 NAKATANI NAOTO
分类号 C08J3/00;C08G59/00;C08J7/00 主分类号 C08J3/00
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