| 摘要 |
PROBLEM TO BE SOLVED: To provide a film deposition apparatus capable of highly precisely controlling the temperature of a surface of a shower head facing a processing space to a setup value. SOLUTION: The film deposition apparatus comprises a chamber for forming a processing space for performing the film deposition on a substrate, a stage provided in the chamber with the substrate placed thereon, a substrate heating means for heating the substrate placed on the stage, a shower head provided facing the stage and having a large number of gas discharge holes, a gas feed mechanism for feeding a processing gas in the chamber via the shower head, a cooling means provided above the shower head to cool the shower head, and a shower head heating means provided above the cooling means to heat the shower head via the cooling means, and the temperature of a surface of the shower head facing the processing space is suppressed thereby. COPYRIGHT: (C)2008,JPO&INPIT
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