发明名称 LASER MACHINING APPARATUS, LASER MACHINING METHOD, AND DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser machining apparatus capable of forming a microstructure by laser irradiation while maintaining high machining throughput, a laser machining method, and a device. <P>SOLUTION: This laser machining apparatus 1 comprises a light source 2 for emitting a linearly polarized pulse laser beam L, a beam branch element 6 for branching the pulse laser beam L emitted from the light source 2 into a plurality of beams LBs, and a stage 8 for relatively moving a workpiece 10 to be irradiated with the branch laser beams LBs along the alignment direction of the branch beams LBs. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008000800(A) 申请公布日期 2008.01.10
申请号 JP20060174258 申请日期 2006.06.23
申请人 SEIKO EPSON CORP 发明人 AMAKO ATSUSHI
分类号 B23K26/067;B23K26/06;B23K26/08 主分类号 B23K26/067
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