发明名称 SUBSTRATE FILM FOR DICING
摘要 PROBLEM TO BE SOLVED: To provide a substrate film for dicing which does not almost have occurrence of cut waste (waste of a thread shape or a whisker shape, which is caused from film after dicing) in a dicing process. SOLUTION: The substrate film for dicing comprises thermoplastic elastomer composition where rubber particles bridged in thermoplastic resin are slightly dispersed. An average particle size of the bridged rubber particles is 0.1 to 50μm. An average value of a ratio of an area of the bridged rubber particles is 1 to 75% with respect to an area of thermoplastic resin in a film face. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008004679(A) 申请公布日期 2008.01.10
申请号 JP20060171340 申请日期 2006.06.21
申请人 GUNZE LTD 发明人 SAGO SHIGERU;YOKOI MASAYUKI
分类号 H01L21/301;C09J7/02;C09J201/00 主分类号 H01L21/301
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