| 摘要 |
PROBLEM TO BE SOLVED: To provide a multiplayer printed wiring board that is structured to require less manufacturing steps to achieve higher productivity, and to be resistant to defects; and to provide a manufacturing method therefor. SOLUTION: The multilayer printed wiring board 30 comprises printed wiring boards 20 that are laminated on one or both surfaces of a flexible printed wiring board 10 as outermost layers. The flexibility of a flexure is maintained by forming grooves 24 for bending in the printed wiring boards 20 as the outermost layers. COPYRIGHT: (C)2008,JPO&INPIT |
