发明名称 BARREL PLATING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a barrel plating device where the variation of plating thickness can be reduced even without using a nonconductive dummy for stirring, also, plating efficiency can be improved, and further, the damage of the object to be plated, a feeding rod, a cathode part and a barrel vessel can be prevented. SOLUTION: The barrel plating device 2 comprises: a plating tank 4; an anode part 6; a freely autorotatable barrel 12; a driving part for a barrel of allowing the barrel 12 to autorotate; a feeding rod 8 formed with a cathode part 10 and inserted into the barrel 12; and a stirring member 11 arranged at prescribed intervals to the feeding rod 8 and having a long shape to the long axis direction of the feeding rod 8. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008001971(A) 申请公布日期 2008.01.10
申请号 JP20060175868 申请日期 2006.06.26
申请人 TDK CORP 发明人 TAKAHASHI MAKOTO;KONNO MASAHIKO;KAMIBAYASHI YOSHIHIRO;ABE YUKIMARE;SHIBUYA KAZUHIRO;HASEBE MASARU;SATO DAIKI;KOIKE MITSUHARU;MASUDA IZUMI;SUGIYAMA TOMONORI;WATANABE HIDETOSHI
分类号 C25D17/16;C25D17/12;C25D17/24 主分类号 C25D17/16
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