发明名称 SHORT-TIME BONDING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a bonding method which permits a sufficiently long time elapsed after adhesive application and therefore excellent workability and permits bonding excellent in water resistance performance by a short-time compaction of 3-10 min at ordinary temperature throughout a year with a water-based adhesive. SOLUTION: The bonding method comprises bonding adherends at least either of which is a porous material with an acetoacetyl group-containing synthetic resin emulsion controlled to a temperature of 15 to 80°C. In a desirable embodiment, the bonding method is one wherein the acetoacetyl group-containing synthetic resin emulsion contains acetoacetylated polyvinyl alcohol. In another desirable embodiment, any of the bonding methods is one wherein the acetoacetyl group-containing synthetic resin emulsion contains a resin obtained by copolymerizing an acetoacetyl group-containing monomer with another monomer. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008001761(A) 申请公布日期 2008.01.10
申请号 JP20060170848 申请日期 2006.06.21
申请人 AICA KOGYO CO LTD 发明人 ASAI DAIJIRO
分类号 C09J201/06;C09J5/00;C09J129/04 主分类号 C09J201/06
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