BONDING RESIN COMPOSITION FOR FLUORORESIN SUBSTRATES AND METAL-CLAD LAMINATES MADE BY USING THE COMPOSITION

摘要

The invention aims at providing a technique which brings about a remarkable improvement in the close adhesion of a fluororesin substrate and a non-coarsened metal foil through easier means and enables the formation of fine-pitch circuits. The aim can be attained by using, as the resin composition for forming the bonding layer for adhesive-bonding a metal foil to a fluororesin substrate, a bonding resin composition for fluororesin substrates which is characterized by comprising 2 to 20 parts by weight of a solvent-soluble polymer component bearing one or more kinds of functional groups selected from among hydroxyl, carboxyl and amino in the molecule and at least 50 parts by weight of an epoxy resin compound consisting of an epoxy resin having a boiling point of 200°C or above and an amine-type curing agent for epoxy resins which has a boiling point of 200°C or above. The invention also provides adhesives for fluororesin substrates which contain the resin composition; an adhesive-covered metal foil (4) which is a laminate constituted of a metal foil (2) and a bonding layer (3); copper-clad laminates made by using the composition; and a process for the production of the laminates.