Montage eines Halbleiterchips in eine Schaltungsplatte

摘要

To provide a process for mounting a semiconductor chip onto a circuit board, capable of adhering resin of ACF to a peripheral lateral surface of the semiconductor chip to a higher height level while avoiding the generation of voids in the inside of the resin of the ACF extending out of the periphery of the semiconductor chip. A semiconductor chip 20 is mounted onto a circuit board 10 via ACF 30 and is pressed against the circuit board 10 while heating the ACF 30 and the peripheral region thereof extending out of the periphery of the semiconductor chip 20. A frame 100 for adding a load is placed on the peripheral region of the ACF so that a gap 110 is formed between the inside surface of the frame and the lateral surface of the semiconductor chip 20, and presses the peripheral region of the ACF 30 against the circuit board 10, whereby the resin of the ACF 30 is forced into the gap 110 and adheres to the peripheral lateral surface of the semiconductor chip 20. Together therewith, gas dwelling in the inside of the peripheral region of the ACF 30 is expelled therefrom to the outer air.