METHOD OF FORMING SEMICONDUCTOR CHIP, THE SEMICONDUCTOR CHIP SO FORMED AND CHIP STACK PACKAGE HAVING THE SAME

摘要

A semiconductor chip, a manufacturing method thereof, and a chip stack package are provided to completely suppress a leakage current by arbitrarily adjusting a spacing between the semiconductor chip and a semiconductor substrate. A semiconductor chip includes a bonding pad(5), an electric line(7), a semiconductor support(9), and a protective film(3). The bonding pad is located on a semiconductor substrate. The electric line is contacted with the bonding pad and elongated to outside from a semiconductor substrate edge. The semiconductor support is contacted with the electric line and spaced apart from the semiconductor substrate. The protective film is arranged between the electric line and the semiconductor substrate. A conductive pattern covers a sidewall or a bottom of the semiconductor support and is contacted with the electric line.