| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device in which it is easy to make the semiconductor device thin and to use connection by means of bonding wire. <P>SOLUTION: The method of manufacturing a semiconductor device having an electrode pad to be connected to a semiconductor chip comprises the first step of forming a support structure comprising a roughed front surface, the second step of forming the electrode pad on the roughed surface of the support structure, and the third step of removing the support structure. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
