| 摘要 |
PROBLEM TO BE SOLVED: To obtain a chuck for prober of simple structure in which measurement can be performed with high precision by reducing leak current. SOLUTION: The chuck for prober for holding a mounted wafer comprises a chuck top 31 made of a conductive material and mounting a wafer, an insulation member 32 made of an insulating material and supporting a bottom surface of the chuck top, and a back plate 34 provided on the underside of the insulation member and arranged to contain a member internally and exhibiting conductivity at least partially on the surface. The insulation member 32 has an upper surface conductive layer 32A provided on the upper surface and a lower surface conductive layer 32B provided on the lower surface wherein the upper surface conductive layer 32A and the lower surface conductive layer 32B are insulated from each other. The upper surface conductive layer touches the bottom surface of the chuck top 31 and the lower surface conductive layer 32B touches the conductive surface of the back plate 34. COPYRIGHT: (C)2008,JPO&INPIT |
