| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing use excellent in fluidity and room temperature-storability, and to provide a semiconductor device sealed with the same. <P>SOLUTION: The epoxy resin composition for sealing use comprises (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a curing promoter obtained by including a curing promoter by a tetrakis-phenolic compound and (D) an inorganic filler. In this composition, the particle size distribution of the inorganic filler D as determined by a laser diffraction-type particle size distribution measuring instrument meets the following requirements(a) and (b): (a) Based on the total weight of the inorganic filler D, the component smaller than 3μm in particle size is at 15-30 wt.%, the component 3-10μm in particle size is at 25-35 wt.%, and the component larger than 10μm in particle size is at 40-50 wt.%. (b) The ratio D1/D2 is 5.0-9.0( wherein D1 and D2 are the weight-average particle size and the number-average particle size of the particles 1μm or larger in size, respectively ). The semiconductor device with its semiconductor elements sealed with the cured product of the above resin composition is also provided. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
