PRINTED CIRCUIT BOARD, ITS MANUFACTURING METHOD, AND PLATING DEVICE

摘要

PROBLEM TO BE SOLVED: To enable a wiring pattern 7 to be densely formed by the method wherein an upper and a lower land patterns 6 and an upper and a lower wiring patterns 7 are formed of a thin metal plating formed in one piece with the metal pillar 5, when a metal-plated pillar 5 is formed by electrolytic plating inside a through hole 4 provided to a core board 1. SOLUTION: The printed circuit manufacturing method comprises a first process of dipping the core board 1 with the through hole 4 into an electrolytic bath that contains a smoother, and setting an electrolytic plating current applied to the first surface 2 of the core board 1 higher in density than that applied to the second surface 3 so as to block the opening at the first surface 2 of the through-hole 4 provided to the core board 1 with an electrolytic plating layer; and a second process of filling the through hole 4 with the metal-plated pillar 5 by carrying out an electrolytic plating process switching electrolytic plating currents applied to the first surface 2 and second surface 3, respectively, in density. COPYRIGHT: (C)2008,JPO&INPIT