| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of repairing a substrate by which a bonded substrate through an adhesive layer can be quickly repaired at a low cost. SOLUTION: A flexible substrate 20 is peeled off from an adhesive layer 30a, and then the marks 31 of an electrode 21 of a substrate 20 left on the adhesive layer 30a is covered; and a second electric insulating resin 40 is applied onto the surface of the adhesive layer 30a. The electrode 21 of a new flexible substrate 20' is engaged with the mark 31 of the electrode 21 left on the adhesive layer 30a, and the new substrate 20' is adhered to the adhesive layer 30a using the resin 40. The content of solder particles of the second electric insulating resin 40 is less than that of a first electric insulating resin 30 forming the adhesive layer 30a, not so as to block the bonding between solder particles S exposed over the surface of the adhesive layer 30a and the electrode 21 of the new substrate 20' by solder particles S' included in the resin 40. COPYRIGHT: (C)2008,JPO&INPIT
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