Halbleiterbauteil und Verfahren zu dessen Herstellung

摘要

A semiconductor device having a plurality of externally connecting electrodes arranged on a semiconductor chip includes on-chip electrodes, resin members formed separately from each other and provided corresponding to the plurality of externally connecting electrodes, and interconnections connecting the corresponding on-chip electrode and the corresponding externally connecting electrode. Such separately formed resin members for the externally connecting electrodes allow relaxation of thermal stress produced in the externally connecting electrodes.