发明名称 Ein Verfahren und eine Anlage zur Aussetzung elektronischer Bauteilen
摘要 A method of exposing components, which are carried by a carrier tape 2, arranged in sequence along the carrier tape 5 and covered by a cover 3. The cover is attached to the carrier tape having a lower surface facing the sequence of components. The method is performed by, while feeding the carrier tape towards the picking position, separating a first portion of the cover from a first portion of the carrier tape. Thereafter, guiding a thus loosened portion of the cover towards the second side of the carrier tape. Performing said guiding such that before reaching the picking position, while being raised to an upright position, the cover is automatically gathered by being folded, so that at least two portions of the lower surface of the cover face each other, thereby reducing the height of the cover. <IMAGE>
申请公布号 DE60313464(T2) 申请公布日期 2008.01.10
申请号 DE2003613464T 申请日期 2003.11.07
申请人 MYDATA AUTOMATION AB 发明人 LARSSON, ANDREAS;PALALIC, MILADIN
分类号 H05K13/02 主分类号 H05K13/02
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