| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring circuit board capable of effectively removing an electrostatic charge and furthermore preventing an early short circuit of a conductive pattern. <P>SOLUTION: A base insulating layer 3 is formed on a metallic supporting substrate 2 so that a base opening part 11 is formed. At one time, the conductor pattern 4 having an intermediate region 14 with a narrow interval D1 between a pair of interconnections 9, a forefront region 15A with a broad interval D2 between a pair of interconnections 9, and a back-end region 15B, is formed on the base insulating layer 3; and a ground connection part 7 is formed in the base opening part 11. A semiconductive layer 5 is formed on each surface of the base insulating layer 3, the conductor pattern 4, and the ground connection part 7, in only the back-end region 15B. A cover insulating layer 6 is formed on the base insulating layer 3 so as to cover the semiconductive layer 5 and the base insulating layer 3. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
