| 摘要 |
A wiring structure according to an embodiment of the present invention includes: a plurality of lead-out lines of different lengths formed on a substrate; a plurality of line cut portions corresponding to the plurality of lead-out lines and cutting the lead-out lines; and a connection portion connecting the lead-out lines cut by the line cut portion, wherein a connection conductive film connecting the lead-out line cut by the line cut portion is formed in the connection portion, and at least one of a width of the connection conductive film and a length of the line cut portion is changed between the plurality of lead-out lines in accordance with a resistance difference between the plurality of lead-out lines.
|
