| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a surface-mounted light emitting device in which air bubbles are prevented from being mixed into a solder when mounted on a substrate, and cracks are prevented from occurring on the solder on a corner of a package. <P>SOLUTION: The surface-mounted light emitting device 1 includes a light emitting element 2, the package 3 for storing the element 2, and a pair of lead electrodes 4 and 5 each exposed along a mounting surface 3b of the package 3 mounted on the substrate 9 and protrusively bent out of the package 3 and each connected with an electrode of the light emitting element 2 in the package 3. <P>COPYRIGHT: (C)2008,JPO&INPIT |
