发明名称 |
SILVER LAYER FORMED BY ELECTROSILVERING SUBSTRATE MATERIAL |
摘要 |
A silver layer formed by electro-plating silver on a substrate material is provided to achieve high reflectivity of 90 to 99% in a visible ray region by setting a crystal grain size in a range of 0.5 mum to 30mum at the outermost surface of the silver layer. A silver layer formed by electro-plating silver on a substrate material(1) comprises an outermost surface having a crystal grain size of 0.5 mum to 30mum. A silver plated layer(6) has a film thickness of 1mum or above, and includes copper. The silver plated layer has a film thickness of 4mum or above, and includes nickel. The substrate material has a surface roughness of 0.5 mum or above. The nickel dose not contains sulfur. The silver plated layer is heated in a temperature of 200°C or above for 30 minutes or above after the electro-slivering process. |
申请公布号 |
KR20080005094(A) |
申请公布日期 |
2008.01.10 |
申请号 |
KR20070067417 |
申请日期 |
2007.07.05 |
申请人 |
MATSUSHITA ELECTRIC WORKS, LTD. |
发明人 |
NAKAHARA YOUICHIRO;IKEGAWA NAOTO |
分类号 |
C25D3/46;H01L33/60;C25D5/10;C25D5/54;C25D7/00;H01L33/00 |
主分类号 |
C25D3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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