发明名称 SILVER LAYER FORMED BY ELECTROSILVERING SUBSTRATE MATERIAL
摘要 A silver layer formed by electro-plating silver on a substrate material is provided to achieve high reflectivity of 90 to 99% in a visible ray region by setting a crystal grain size in a range of 0.5 mum to 30mum at the outermost surface of the silver layer. A silver layer formed by electro-plating silver on a substrate material(1) comprises an outermost surface having a crystal grain size of 0.5 mum to 30mum. A silver plated layer(6) has a film thickness of 1mum or above, and includes copper. The silver plated layer has a film thickness of 4mum or above, and includes nickel. The substrate material has a surface roughness of 0.5 mum or above. The nickel dose not contains sulfur. The silver plated layer is heated in a temperature of 200°C or above for 30 minutes or above after the electro-slivering process.
申请公布号 KR20080005094(A) 申请公布日期 2008.01.10
申请号 KR20070067417 申请日期 2007.07.05
申请人 MATSUSHITA ELECTRIC WORKS, LTD. 发明人 NAKAHARA YOUICHIRO;IKEGAWA NAOTO
分类号 C25D3/46;H01L33/60;C25D5/10;C25D5/54;C25D7/00;H01L33/00 主分类号 C25D3/46
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