| 摘要 |
A molding apparatus for a semiconductor device and a molding method using the same are provided to prevent a discontinuity in a semiconductor molding process by automatically supplying a dummy substrate to a resin mold, when no semiconductor device is supplied to the resin mold. A molding apparatus molds plural semiconductor devices by using a resin mold, on which plural mounting portions are formed. A stage portion(100) includes plural device stages and a dummy stage. The device stages sequentially supply plural semiconductor devices. The dummy stage sequentially supplies plural dummy substrates. A sorting portion(200) receives the semiconductor devices from the device stage and sorts the received semiconductor devices. The sorting portion checks a supply state of the semiconductor devices. When one or more semiconductor device is not correctly supplied, the sorting portion receives the dummy substrate from the dummy stage.
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