PREPREG AND COPPER-CLAD LAMINATE

摘要

PROBLEM TO BE SOLVED: To provide such a prepreg and a copper-clad laminate for use in an LED-mounting printed wiring board which has high heat resistance and has high light reflectivity in the ultraviolet radiation region and in the visible radiation region and little drop in the light reflectivity owing to a heat treatment or a photoirradiation treatment.

SOLUTION: The prepreg and the copper-clad laminate using it comprise a substrate and a resin composition which contains (A) a bisphenol A novolac-type epoxy resin, (B) an alicyclic epoxy resin, and (C) titanium dioxide.

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