METHOD FOR PRODUCING POLISHING PAD, AND POLISHING PAD

摘要

PROBLEM TO BE SOLVED: To provide a polishing pad capable of improving center slow, a method for producing the pad and a method for producing a semiconductor device by using the polishing pad.

SOLUTION: The method for producing a polishing pad comprises a step to dissolve a non-reactive gas under pressure in a first component containing an isocyanate component and/or a second component containing a compound having active hydrogen group, a step to inject a polyurethane composition comprising a mixture of the first component and the second component into a mold by reaction injection molding and foaming and curing the composition to form a first polishing region, and a step to inject the polyurethane composition into the mold having the first polishing region by reaction injection molding and foaming and curing the composition to form the second polishing region having an average foam diameter and/or average foam number different from those of the first polishing region and integrally formed at the inside and/or outside of the first polishing region.

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