| 摘要 |
PROBLEM TO BE SOLVED: To suppress impairment of a rolling mechanism due to inflow of gas from a reactor to the rolling mechanism, and to suppress impairment of a device due to smearing of a wafer. SOLUTION: The semiconductor production apparatus comprises a reactor 2 for forming a film on a wafer 1 to be processed by supplying/discharging process gas, a supporting section installed in the reactor 2 and holding the wafer 1 to be processed, an opening 2a provided in the reactor 2, a rolling mechanism 4 coupled with the reactor 2 and rotating the wafer 1 to be processed, and a rotating shaft 5 coupled with the supporting section 3 and the rolling mechanism 4 while penetrating the opening 2a and having a spiral blade 5a in the axial direction. COPYRIGHT: (C)2008,JPO&INPIT |
