| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a heat conducting substrate hardly causing contamination due to a heat transmissive resin easily generated on the surface of a die (not shown in a figure) or a void in the inside or on the surface of the heat conducting resin, on the surface of a lead frame, when the lead frame is heated and pressurized to be integrated with a metal plate using a heat transmissive resin sandwiched between them, and to provide a heat conducting substrate manufactured by this method. SOLUTION: A lead frame 10 is stuck on a film 14, and then, a hole 17 is formed on the stuck film 14 by a hole opening means 15. The lead frame 10 is stacked and integrated with a heat transmissive resin 11 and a metal plate 13 in this state. Thus, contamination of the die or a void 5 can be suppressed. Further, a protrusion 18 of the heat conducting resin 11 or the trace of the protrusion 18 generated after the film 14 is peeled is positively allowed to remain on one or more parts on the heat conducting resin 11 for an anchor effect for a solder resist. COPYRIGHT: (C)2008,JPO&INPIT |
