| 发明名称 |
Method of forming a semiconductor device |
| 摘要 |
A method of forming a semiconductor device includes the following processes. A semiconductor wafer including chips and through electrodes is diced into chip groups. The chip groups are stacked to form a module group. |
| 申请公布号 |
US2008009124(A1) |
申请公布日期 |
2008.01.10 |
| 申请号 |
US20070824626 |
申请日期 |
2007.07.02 |
| 申请人 |
|
发明人 |
ISHINO MASAKAZU;IKEDA HIROAKI |
| 分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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