An apparatus for sawing a wafer is provided to perform simultaneously a sawing process on plural wafers by installing plural transfer members and plural chuck tables in a work space. A wafer loading/unloading unit(110) has a wafer cassette(115). Plural wafers to be sawed or been sawed are mounted on the wafer cassette. Plural transfer members(125) transfer the wafer mounted on the wafer cassette to a work place where a sawing process is performed. Plural chuck tables(135) are installed in the work place. A real wafer sawing process is performed at the chuck tables. The number of the transfer members and the chuck tables are the same. The number of the transfer members and the chuck tables are respectively four. The transfer members are arranged as height difference as an interval between wafers in the wafer cassette.
