发明名称 Method for manufacturing printed circuit board using imprinting
摘要 The present invention relates to a method for manufacturing a printed circuit board, more particularly to a method for manufacturing a printed circuit board, in which an oxidant capable of polymerizing conductive polymers is selectively marked on a board using imprinting, and the monomer of a conductive polymer is filled in the selected pattern and polymerized, to provide a conductive polymer wiring pattern. With the method for manufacturing a printed circuit board according to certain aspects of the invention as set forth above, a printed circuit board can be given finer wiring widths to allow a highly integrated, highly efficient printed circuit board. Thus, a printed circuit board (PCB) or a flexible printed circuit boards (FPCB) can be manufactured that is applicable to industrial, clerical, and domestic electric electronic products, by a new technique of forming conductive polymer wiring using imprinting.
申请公布号 US2008008824(A1) 申请公布日期 2008.01.10
申请号 US20070819720 申请日期 2007.06.28
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 CHO JAE-CHOON;HONG MYEONG-HO;RA SENUG-HYUN;LEE HYUK-SOO;KWAK JEONG-BOK;LEE JUNG-WOO;LEE CHOON-KEUN;LEE SANG-MOON
分类号 H05K3/46 主分类号 H05K3/46
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