发明名称 |
CONDUCTIVE PARTICLE, ADHESIVE COMPOSITION, CIRCUIT-CONNECTING MATERIAL, CIRCUIT-CONNECTING STRUCTURE, AND METHOD FOR CONNECTION OF CIRCUIT MEMBER |
摘要 |
<p>A conductive particle comprising: a core particle having an electrical conductivity; and a insulating coating provided on the surface of the core particle and comprising an organic polymeric compound, wherein the conductive particle has a coverage ratio as defined by the formula (1) of 20 to 40%.</p> |
申请公布号 |
WO2008004367(A1) |
申请公布日期 |
2008.01.10 |
申请号 |
WO2007JP57978 |
申请日期 |
2007.04.11 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD.;TANAKA, MASARU;TAKETATSU, JUN |
发明人 |
TANAKA, MASARU;TAKETATSU, JUN |
分类号 |
H01B5/00;C09J9/02;C09J11/00;C09J201/00;H01B1/20;H05K3/32 |
主分类号 |
H01B5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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