发明名称 CONDUCTIVE PARTICLE, ADHESIVE COMPOSITION, CIRCUIT-CONNECTING MATERIAL, CIRCUIT-CONNECTING STRUCTURE, AND METHOD FOR CONNECTION OF CIRCUIT MEMBER
摘要 <p>A conductive particle comprising: a core particle having an electrical conductivity; and a insulating coating provided on the surface of the core particle and comprising an organic polymeric compound, wherein the conductive particle has a coverage ratio as defined by the formula (1) of 20 to 40%.</p>
申请公布号 WO2008004367(A1) 申请公布日期 2008.01.10
申请号 WO2007JP57978 申请日期 2007.04.11
申请人 HITACHI CHEMICAL COMPANY, LTD.;TANAKA, MASARU;TAKETATSU, JUN 发明人 TANAKA, MASARU;TAKETATSU, JUN
分类号 H01B5/00;C09J9/02;C09J11/00;C09J201/00;H01B1/20;H05K3/32 主分类号 H01B5/00
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