| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can increase manufacturing yield. <P>SOLUTION: The semiconductor device includes a first semiconductor chip, a plurality of connections arranged around the first semiconductor chip, a plurality of electrode pads of the first semiconductor chip provided across corresponding peripheral edges of a main surface of the first semiconductor chip, a plurality of bonding wires electrically connected to the plurality of connections respectively, projections provided to be extruded from the main surface of the first semiconductor chip at portions of the peripheral edges of the main surface of the first semiconductor chip crossed by the plurality of bonding wires, and a second semiconductor chip bonded and fixed onto the main surface of the first semiconductor chip with a bonding material and parts of the plurality of bonding wires disposed between the first and second semiconductor chips. <P>COPYRIGHT: (C)2008,JPO&INPIT |
