| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling apparatus which can establish high cooling efficiency inside a PC enclosure inexpensively, low noise and high reliability, in comparison with the conventional cooling measures using microbubble emission boiling for an MPU for PC as a super-high density heat source, which requires a large-scales mechanism for necessary cooling capacity and too much cost and large occupancy volume. SOLUTION: A pump 4 is used to increase the velocity of a refrigerant passing over a heating surface, thus establishing stable microbubble emission boiling state even in a cooling circulation system wherein the degree of subcool is not large enough. Then, an auxiliary pump is used together, so as to realize microbubble emission boiling state even in still smaller subcool environment. In addition, a protective film is provided on the heating surface to ensure high reliability. Furthermore, the operation state of the PC is reflected on the rotational frequency of a fan 6 to prevent noises. COPYRIGHT: (C)2008,JPO&INPIT |
